Job Description
■ Main Responsibilities
- Design and integrate post‑FAB and assembly processes; develop MTS(Manufacturing Test Specification) for the flow.
- Review product structure and process PRP(Process Reference Plan); conduct performance and reliability assessments; perform failure analysis(pFA).
- Develop commercialization‑ready package technologies and products(2.5‑D / 3‑D / 3.5‑D).
- Lead multi‑chip integration and system‑level package development.
- Create packages based on a thorough understanding of FAB, bump, and post‑FAB processes.
- Execute DOE(Design of Experiments) and statistical analysis; evaluate product characteristics and reliability; conduct failure analysis (pFA).
- Establish project milestones, manage risks, and drive product technology development.
Packaging Engineering
¦ Required / Preferred Qualifications
- Fundamental knowledge of semiconductor package materials and hands-on integration development experienc...