Job Description
ITEC in Kuala Lumpur is seeking a Die Bond Product Engineering Manager to lead cutting-edge die attach technology for high-performance solutions. You will oversee product performance applications across key segments, ensuring competitiveness in reliability and cost-effectiveness.
Ideal candidates have over 10 years in semiconductor manufacturing and proven leadership in product engineering. Fluency in Mandarin and/or Cantonese is a plus. Join us to make a significant impact in the technology field.
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