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Full-Time Opportunity: This is a permanent, full-time position with a competitive package and real career growth potential.
Job Description
Responsibilities
- Develop, qualify, and optimize Die Attach and Flip Chip assembly processes for semiconductor packaging.
- Provide process engineering support for production lines, including troubleshooting yield and quality issues.
- Perform process characterization, DOE (Design of Experiments), and process optimization to improve performance and reliability.
- Support new product introduction (NPI) and process transfer from development to high-volume manufacturing.
- Work closely with equipment, materials, and product engineering teams to resolve process-related issues.
- Establish and maintain process documentation, specifications, and control plans.
- Drive continuous improvement initiatives to enhance yield, productivity, and cycle time.
- Analyze failure modes and reliability concerns related to die attach and flip chip processes.
- Interface with equipment vendors and material suppliers to qual...