Job Description
Key Responsibilities
- Lead end-to-end surface treatment workflows (Cleaning, Polishing, Anodizing, Plating, etc.) from NPI through Mass Production, ensuring seamless transitions between internal and external stages.
- Hands‑on management of in‑house Cleaning, Polishing and Laboratory bath analysis.
- Act as the technical lead for 3rd‑party surface treatment vendors.
- Conduct process audits, review chemical bath reports, and ensure suppliers meet semiconductor‑grade purity and cosmetic standards.
- Lead Failure Analysis (FA) for defects such as pitting, discoloration, or outgassing issues. Distinguish whether defects originated from in‑house machining, cleaning, or 3rd‑party plating.
- Drive First Article Inspection (FAI) and process qualification (IQ/OQ/PQ) for new parts.
- Establish and maintain robust SOPs, WIs, PFMEAs, and Control Plans. Ensure all chemical handling aligns with environmental and safety regulations.