Job Description
Job Description
Join the MediaTek Chip Physical Verification team and help create technology for products that will delight and inspire millions of people every day. As a member of our team, you will define and enable physical sign-off flows and solutions for SoC and Multi-Dies (3D IC) design, ensuring first-time success in product tape-out. In this role, you will develop and implement technologies at advanced process nodes, contributing to the success of cutting‑edge products.
Responsibilities
- Responsible for Multi-Dies Physical Verification Sign‑off in the area of 3D_Stack, 3D_PERC, 3D_ANT for tape‑out.
- Co‑work with Package Design Team to resolve Multi‑Die integration issues.
- Co‑work with ESD Team to run 3D_PERC flow.
- Coordinate with Chip PV Team on active die related issues (DRC, LVS, ANT, ERC, ESD).
- Provide automation solutions to improve efficiency in tape‑out flow.
- Report on Tapeout PV issue...