💼 Full-Time Position

Engr Prin, Package Development (NPI Mold Engineer)

🏢
onsemi
📍 seremban, negeri sembilan, Malaysia
📍
Location
seremban, Malaysia
📅
Posted
June 01, 2026
Type
Full-Time
🎯

Full-Time Opportunity: This is a permanent, full-time position with a competitive package and real career growth potential.

Job Description

Job Summary

Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. Key person responsible to align processes between R&D and Manufacturing. Establish process POR through setup, feasibility and characterization followed by package development procedure.

Responsibilities

  • End of Line process development and enabling technology for molded package.
  • Capable to understand the design and proposal for improvement from End of Line process.
  • Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA.
  • Familiar with EMC materials.
  • Capability to define KPIV from failures modes.
  • Capability to define KPOV and generate output by analyzing process capability.
  • Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab).
  • Effectively working with technical leaders to generate process deliverables (Control Pla...