💼 Full-Time Position

Engr Prin, Package Development (NPI Mold Engineer)

🏢
onsemi
📍 Seremban, Malaysia, Malaysia
📍
Location
Seremban, Malaysia
📅
Posted
June 02, 2026
Type
Full-Time
🎯

Full-Time Opportunity: This is a permanent, full-time position with a competitive package and real career growth potential.

Job Description

**Job Summary:**

· Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development.

· Key person responsible to align processes between R&D and Manufacturing.

· Establish process POR through set up, feasibility and characterization followed by package development procedure.

**onsemi** (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

**More details about our company benefits can be found here:**

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