💼 Full-Time Position

Engr Prin, Package Development (NPI Mold Engineer)

🏢
Onsemi
📍 Seremban, Negeri Sembilan, Malaysia
📍
Location
Seremban, Malaysia
📅
Posted
June 02, 2026
Type
Full-Time
🎯

Full-Time Opportunity: This is a permanent, full-time position with a competitive package and real career growth potential.

Job Description

Job Summary: 

· Discrete and Power module assembly process (End of Line: Mold, Trim/Form, CD/ED) Development. 


· Key person responsible to align processes between R&D and Manufacturing. 


· Establish process POR through set up, feasibility and characterization followed by package development procedure. 

Responsibilities


· End of Line process development and enabling technology for molded package. 


o Capable to understand the design and proposal for improvement from End of Line process. 


o Familiar with DFMEA, update DFMEA and generate PFMEA linked with DFMEA. 


o Familiar with EMC materials. 


o Capability to define KPIV from failures modes. 


o Capability to define KPOV and generate output by analyzing process capability. 


o Responsible for providing technical report from FMEA failures mode based on statistical analysis (JMP, Minitab). 


o Effectively working wi...