💼 Full-Time Position

HBM Packaging Engineer – NPI & High-Speed Memory

🏢
Micron Technology, Inc
📍 singapore, singapore, Singapore
📍
Location
singapore, Singapore
📅
Posted
June 03, 2026
Type
Full-Time
🎯

Full-Time Opportunity: This is a permanent, full-time position with a competitive package and real career growth potential.

Job Description

Micron Technology, Inc in Singapore is seeking an Engineer for the High Bandwidth Memory and New Product Introduction team. This role involves integrating AI-assisted tools to enhance product transitions from development to high-volume manufacturing.

The ideal candidate will have a degree in a relevant engineering field and strong analytical skills. Responsibilities include risk assessments and collaboration with manufacturing teams.

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