💼 Full-Time Position

Lead Platform Packaging Engineer

🏢
Infineon Technologies AG
📍 malacca city, malacca, Malaysia
📍
Location
malacca city, Malaysia
📅
Posted
June 03, 2026
Type
Full-Time
🎯

Full-Time Opportunity: This is a permanent, full-time position with a competitive package and real career growth potential.

Job Description

Infineon Technologies AG in Malacca City is seeking a Package Design Engineer to lead technical definition activities for packaging projects. Candidates should have a Bachelor’s Degree in Engineering and at least 9 years of relevant experience in the IC/semiconductor field.

The role entails generating internal drawings, defining package requirements, and coordinating cost estimates. Infineon values diversity and offers an inclusive work environment.

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