💼 Full-Time Position

Package Design Engineer

🏢
Broadcom Inc.
📍 Singapore, Singapore, Singapore
📍
Location
Singapore, Singapore
📅
Posted
June 04, 2026
⏰
Type
Full-Time
🎯

Full-Time Opportunity: This is a permanent, full-time position with a competitive package and real career growth potential.

Job Description

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Job Description:

Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 112G and higher, RF/Microwave ADC/DAC, DDR and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design.

RESPONSIBILITIES:

  • Overall design responsibi...