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Full-Time Opportunity: This is a permanent, full-time position with a competitive package and real career growth potential.
Job Description
Primary Duties & Responsibilities
Drive Co-Packaged Optics and Optical Engine product design and testing activities from initial concept to production. Develop Silicon Photonic (PIC) and electronics IC (including TIA, driver, and micro-controller) co-design to achieve DC functionalities and high-speed performance. Perform simulations for signal integrity and power integrity analysis, hands-on high speed signal validation and analysis verification including material, de-embedding, and component characterization. Power delivery modeling, simulation, and characterization for die, package, board, and voltage regulators. PCB stack-up review and layer assignment for High speed and PDN Manage PIC and EIC interconnect schematic and monitor layout design process. Work with external and internal PIC and EIC suppliers to define product spec, integration design rules, testing protocol, and failure analysis methodologies.