Process Development Engineer: Die Attach & Flip Chip

Analog Devices, Inc. in Malaysia, Penang is seeking an Engineer in Process Development. The successful candidate will develop and optimize Die Attach and Flip Chip assembly processes, provide support for production lines, and enhance semiconductor packaging processes. Candidates should possess a relevant degree and 3–10 years of experience in semiconductor manufacturing. A strong knowledge of bonding techniques and communication skills are essential. The position offers full-time employment with opportunities for career growth.
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