Job Description
Ready to launch your engineering career? We're growing rapidly and have multiple openings for talented engineers who want to work with advanced semiconductor technologies and make a real impact from day one.
Join our Semiconductor Assembly Engineering team and take ownership of some of the most critical processes in advanced semiconductor manufacturing. As a Process & Equipment Engineer, you will work directly with state-of-the-art Die Bond and Wire Bond equipment in a high-volume Reel-to-Reel (R2R) production environment, driving yield improvements, equipment performance, and next-generation product introductions.
This is an excellent opportunity for engineers who enjoy hands-on technical work, data analysis, continuous improvement projects, and making a visible impact on manufacturing performance.
What You'll Do
As the technical owner for Die Bond or Wire Bond processes, you will: