Job Description
Responsibilities Lead local Hybrid Bonding equipment full-cycle R&D, architecture design, technical breakthrough and iteration. Connect with local & Southeast Asian OSAT/wafer fabs, match HBM, Chiplet, 3D stacking process demands, deliver technical solutions. Oversee precision mechanism, nano alignment, motion control, vacuum & temp-pressure control, electrical and software system integration & debugging. Complete prototype tuning, accuracy optimization, yield improvement and customer acceptance, resolve mass production technical issues. Manage local R&D team, formulate R&D standards, coordinate local supply chain to realize localized mass production. Track frontier industry technology, carry out technical pre-research and patent layout to boost business commercialization.
Requirements Bachelor or above, major in Mechanics, Automation, Microelectronics, Semiconductor Equipment etc., Master preferred. 10+ years semiconductor packaging equipment R&D experience, 5+ years Hybrid Bonder ...
Requirements Bachelor or above, major in Mechanics, Automation, Microelectronics, Semiconductor Equipment etc., Master preferred. 10+ years semiconductor packaging equipment R&D experience, 5+ years Hybrid Bonder ...