Job Description
Responsibilities
- Support the development of thin film deposition, etching, wet cleaning, wafer bonding and release process modules to enable the fabrication of innovative MEMS devices.
- Collaboration with process integration team to establish manufacturable fabrication procedures and perform basic process tuning.
- Work closely with the equipment engineering team to identify hardware issue and carry out basic troubleshooting of faulty equipment.
- Perform routine metrology measurements to monitor and ensure stable process performance.
- Diploma or above in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Chemistry, Physics or related fields.
- 3 years of semiconductor or MEMS related working experience is advantageous.
- Experience in thin film deposition, etching, wet cleaning, wafer bonding or release process is desired.
- Hands‑on experie...