Senior Packaging & SI/PI Engineer for Micro‑Electronics

A technology company in Singapore is seeking a middle to senior level packaging design and signal/power integrity Engineer. The role involves designing micro-electronic packages, collaborating with a multi-disciplinary team, and optimizing performance through simulation. Candidates should possess a Bachelor’s degree and 5 years of experience, with strong skills in substrate design and EDA tools like Siwave and HFSS. The position offers competitive salary, comprehensive benefits, and opportunities to work with cutting-edge technologies.
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