Job Description
Company: Qualcomm Asia Pacific Pte. Ltd.
Job Area: Engineering Group, Engineering Group > Hardware Engineering
General Summary: Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization and work directly with and support multiple product development teams.
Position requires a senior technical specialist who can provide leadership in the development of new and sustainable technology platforms for the company using a solid background in materials, device physics, front end or back end processes, and supplier interactions.
Responsibilities:
Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment.
Support development of advanced technologies for Si / GaAs backend interconnect, passivation, RDL, bump and flip chip packaging (CPI).
Monitor and improve existing processes to improve yield, quality, and ...
Job Area: Engineering Group, Engineering Group > Hardware Engineering
General Summary: Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization and work directly with and support multiple product development teams.
Position requires a senior technical specialist who can provide leadership in the development of new and sustainable technology platforms for the company using a solid background in materials, device physics, front end or back end processes, and supplier interactions.
Responsibilities:
Exhibit skill and confidence in working cross-functionally across a matrix organization in a very dynamic and fast-paced environment.
Support development of advanced technologies for Si / GaAs backend interconnect, passivation, RDL, bump and flip chip packaging (CPI).
Monitor and improve existing processes to improve yield, quality, and ...