[Sept 2026 intake - Fresh Grad Only] Technology Development Engineering (Failure Analysis)

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Perform package and device analysis on assembly test defect from production and qualification on semi-finished or finished products.
• Define the Failure Analysis flow for each case.
• Generate Failure Analysis report and assist teams for root-causing of defect/s. 
• Maintain lab in quality system compliance.

REQUIRED:

• Master's / Bachelor’s Degree in Electrical & Electronic or Material Engineering 

PREFERRED:

• Familiar with package and device analysis methodology
• Familiar with memory product technology and structure
• Understand memory product test process and methodology
• Strong memory IC de-processing skills.
• Good communication, presentation skills and teamwork spirit.
• Fluent in English speaking, reading and technical FA report writing