Job Description
As a
Bonding Process & Equipment Engineer at Micron Technology
, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding). You will drive
yield improvement, cost reduction, process capability enhancement, and risk management
, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites. Key Responsibilities Process Development & Optimization
Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)
Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets
Drive process capability improvement (Cpk) and defect reduction
Yield & Reliability Improvement
Lead yield ...
Bonding Process & Equipment Engineer at Micron Technology
, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding). You will drive
yield improvement, cost reduction, process capability enhancement, and risk management
, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites. Key Responsibilities Process Development & Optimization
Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)
Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets
Drive process capability improvement (Cpk) and defect reduction
Yield & Reliability Improvement
Lead yield ...