Job Description
Your Role
Key responsibilities in your new role
- Sustain daily activity (e.g. Assembly / Test DDM, FAR, Yield, and etc.)
- Support GCM & Technical discussion.
- Support SON new product release and ramp.
- Drive WB yield improvement (CIP).
Your Profile
Qualifications and skills to help you succeed
- Bachelor's degree in Mechanical / Electrical / Electronics / Microelectronics / Mechatronics / Materials Science / Semiconductor Technology.
- Min 5 years related experience in FOL / Die Bond Process Engineering or in Semiconductor Assembly Manufacturing background.
- Knowledge of statistical data analysis, analytical and problem-solving skills.
- Ability to anticipate issues and challenges and resolving them quickly.
- Expert in process knowledge and skills in manufacturing process & some equipment knowledge.
- Systematic Problem-Solving methodology (e.g. 8D, DMAIC, Process Map...